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| Influence of minor Zn addition on the microstructural stability of Sn-0.7 wt% Cu solder after aging and electromigration | 245 |
| Agosto 2025 | Setembro 2025 | Outubro 2025 | Novembro 2025 | Dezembro 2025 | Janeiro 2026 | Fevereiro 2026 | |
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| Influence of minor Zn addition on the microstructural stability of Sn-0.7 wt% Cu solder after aging and electromigration | 3 | 17 | 20 | 15 | 11 | 20 | 0 |
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| Bernardo Bortolotto Ilha_.pdf | 100 |
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| Brazil | 245 |
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