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| Influence of minor Zn addition on the microstructural stability of Sn-0.7 wt% Cu solder after aging and electromigration | 99 |
| Novembro 2023 | Dezembro 2023 | Janeiro 2024 | Fevereiro 2024 | Março 2024 | Abril 2024 | Maio 2024 | |
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| Influence of minor Zn addition on the microstructural stability of Sn-0.7 wt% Cu solder after aging and electromigration | 1 | 0 | 0 | 0 | 3 | 4 | 0 |
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| Bernardo Bortolotto Ilha_.pdf | 24 |
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| Brazil | 99 |
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