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| Influence of minor Zn addition on the microstructural stability of Sn-0.7 wt% Cu solder after aging and electromigration | 157 |
| Janeiro 2025 | Fevereiro 2025 | Março 2025 | Abril 2025 | Maio 2025 | Junho 2025 | Julho 2025 | |
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| Influence of minor Zn addition on the microstructural stability of Sn-0.7 wt% Cu solder after aging and electromigration | 5 | 2 | 4 | 2 | 5 | 15 | 0 |
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| Bernardo Bortolotto Ilha_.pdf | 65 |
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| Brazil | 157 |
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